PACK EXPO International

PACK EXPO International 2026, held at Chicago’s McCormick Place, is set to be the premier packaging and processing trade show in North America, offering an unparalleled opportunity to explore the latest innovations across industries such as food & beverage, healthcare, e-commerce, and more. This event brings together thousands of professionals, including C-level executives, engineers, and plant managers, to experience live machinery demonstrations, new product launches, and cutting-edge solutions in automation, robotics, printing, labeling, and supply chain technologies. Fujifilm is proud to be a key participant, showcasing its advanced digital printing technologies, including the J Press FP790 digital flexible packaging press and the J Press 750HS for digital folding carton printing. These innovations exemplify Fujifilm’s commitment to helping print businesses evolve by enhancing speed, agility, and efficiency while complementing traditional analog methods.

At PACK EXPO International 2026, attendees will have the unique chance to engage directly with Fujifilm experts and discover how our comprehensive portfolio of digital printers and presses, supported by our hybrid, integration-ready software suite, can simplify job preparation, streamline color management, and maximize operational performance. Fujifilm’s dedication extends beyond technology, offering professional services and business-development programs designed to boost profitability and growth. In a competitive and fast-changing marketplace, Fujifilm provides the innovation, automation, support, and partnership needed to help you make more of what matters—more impressions, more impact, more satisfied customers, and ultimately, more profit. Join us at PACK EXPO International 2026 and let’s make more together.